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SQJ488EP-T2_GE3 Vishay Siliconix N-Channel 100 V 42A Tc 83W Tc Surface Mount Ic PowerPAK SO-8
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xManufacturer | Vishay Siliconix | Category | Single FETs, MOSFETs |
---|---|---|---|
Product Number | SQJ488EP-T2_GE3 | Technology | MOSFET (Metal Oxide) |
Drain To Source Voltage (Vdss) | 100 V | Current - Continuous Drain (Id) @ 25°C | 42A (Tc) |
Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V | Rds On (Max) @ Id, Vgs | 21mOhm @ 7.1A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 250µA | Vgs (Max) | ±20V |
Input Capacitance (Ciss) (Max) @ Vds | 83W (Tc) | Operating Temperature | -55°C ~ 175°C (TJ) |
Supplier Device Package | PowerPAK® SO-8 | Mounting Type | Surface Mount |
High Light | SQJ488EP-T2_GE3,Surface Mount ic |
SQJ488EP-T2_GE3 N-Channel 100 V 42A (Tc) 83W (Tc) Surface Mount PowerPAK® SO-8
Datasheet:SQJ488EP-T2_GE3
Category | Single FETs, MOSFETs |
Mfr | Vishay Siliconix |
Series | Automotive, AEC-Q101, TrenchFET® |
Product Status | Active |
FET Type | N-Channel |
Technology | MOSFET (Metal Oxide) |
Drain to Source Voltage (Vdss) | 100 V |
Current - Continuous Drain (Id) @ 25掳C | 42A (Tc) |
Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
Rds On (Max) @ Id, Vgs | 21mOhm @ 7.1A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 250µA |
Gate Charge (Qg) (Max) @ Vgs | 27 nC @ 10 V |
Vgs (Max) | ±20V |
Input Capacitance (Ciss) (Max) @ Vds | 978 pF @ 50 V |
Power Dissipation (Max) | 83W (Tc) |
Operating Temperature | -55°C ~ 175°C (TJ) |
Mounting Type | Surface Mount |
Supplier Device Package | PowerPAK® SO-8 |
Package / Case | PowerPAK® SO-8 |
FEATURES • TrenchFET® power MOSFET • AEC-Q101 qualified d • 100 % Rg and UIS tested • Material categorization: for definitions of compliance please see http://www.vishay.com/doc?99912
Notes
a. Package limited
b. Pulse test; pulse width 300 μs, duty cycle 2 %
c. When mounted on 1" square PCB (FR-4 material)
d. Parametric verification ongoing
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
Data Picture: