Module Memory IC Chip 8GB EMMC5.1 HS400 KLM8G1GETF-B041 SAMSUNG

Product Description:

HyperX FURY Memory IC Chip is a flash memory IC chip with an industry-leading voltage of 1.2V. It has a memory capacity of 32GB and uses the Unbuffered module type. It comes without a Heat Spreader and is compliant to the EMMC v5.1 HS400 standard. It is the ideal choice for any consumer looking for a reliable and powerful Memory IC Chip.

Features:

• Product Name: Memory IC Chip
• Memory Type: EMMC
• Warranty: Lifetime
• Module Type: Unbuffered
• Form Factor: DIMM
• Series: HyperX FURY
• Brand: SAMSUNG
• Capacity: 32GB
• Interface: UFS 3.0

Technical Parameters:

Applications:

The SAMSUNG KLMBG2JETD-B041 Memory IC Chip is an EMMC with a 32GB capacity. It has a v5.1 HS400 interface that can easily be integrated into most applications. This SAMSUNG chip is certified CE and comes in a BGA package. It is available with a minimum order quantity of 96 and has a delivery time of 3-5 days. Payment can be made via TT and the supply ability is 10000 pieces. The chip also features no LED lighting and no heat spreader, making it a great choice for unbuffered applications.

Customization:

Customized Memory IC Chip from SAMSUNG

Model Number: KLMBG2JETD-B041

Place of Origin: KR

Certification: CE

Minimum Order Quantity: 96

Packaging Details: BGA

Delivery Time: 3-5 DAYS

Payment Terms: TT

Supply Ability: 10000

Module Type: Unbuffered

Voltage: 1.2V

LED Lighting: No

Form Factor: DIMM

Memory Capacity: 32GB

Features:

• SAMSUNG Flash Memory IC Chip
• KLMBG2JETD-B041
• Packaged with BGA
• Unbuffered DIMM
• Voltage: 1.2V
• Memory Capacity: 32GB

Support and Services:

We offer a variety of technical support and services for Memory IC Chip, including but not limited to:

• 24/7 technical support by phone and email
• Free firmware updates and upgrades
• Free troubleshooting and diagnostic services
• Free installation and setup assistance
• Warranty services for defective products
• Onsite maintenance and repair services

Packing and Shipping:

• Memory IC Chips should be packaged in an antistatic bag.
• The bag should be placed in a static-shielding bag with a moisture barrier.
• The static-shielding bag should be placed in a corrugated box.
• The box should be properly sealed for shipping.
• The box should be labeled with the appropriate shipping information.
• The box should be shipped using a reliable carrier.

FAQ:

• Q: What is SAMSUNG Memory IC Chip?
  A: SAMSUNG Memory IC Chip (Model Number: KLMBG2JETD-B041) is an integrated circuit designed for use in computing devices. It stores data and instructions to be used by the processor.
• Q: Where is SAMSUNG Memory IC Chip made?
  A: SAMSUNG Memory IC Chip is made in Korea (Place of Origin: KR).
• Q: Does SAMSUNG Memory IC Chip have a certification?
  A: Yes, SAMSUNG Memory IC Chip has a CE certification.
• Q: What is the minimum order quantity for SAMSUNG Memory IC Chip?
  A: The minimum order quantity for SAMSUNG Memory IC Chip is 96.
• Q: What is the packaging for SAMSUNG Memory IC Chip?
  A: The packaging for SAMSUNG Memory IC Chip is BGA.
• Q: How long will it take to deliver SAMSUNG Memory IC Chip?
  A: It will take 3-5 days to deliver SAMSUNG Memory IC Chip.
• Q: What payment terms are accepted for SAMSUNG Memory IC Chip?
  A: The payment terms accepted for SAMSUNG Memory IC Chip are TT.
• Q: What is the supply ability for SAMSUNG Memory IC Chip?
  A: The supply ability for SAMSUNG Memory IC Chip is 10000.